On the 27th, it was learned from Xihu University that Professor Kong Wei's team from the School of Engineering has successfully achieved high-quality integration of wafer level single crystal molybdenum disulfide thin films on flexible substrates, advancing the technology of single crystal two-dimensional semiconductor transfer integration from the "wet" to the "dry" route, providing a new path to break through the technological bottleneck that has long constrained the development of high-performance flexible electronics. The relevant research results were recently published in the journal Nature Electronics. Two dimensional semiconductor materials represented by single crystal molybdenum disulfide, which possess atomic level thickness flexibility and excellent electrical properties, are important candidate materials for the development of high-performance flexible electronic devices. But its clean, high-quality, and scalable transfer integration has always been a challenge in the industry. Previously, such materials were typically grown epitaxially on sapphire substrates using chemical vapor deposition and transferred to flexible substrates using "wet transfer" techniques. However, this method requires the use of polymers, water, or organic solvents, which can leave difficult to eradicate residues on the surface of the material, affecting its properties. The research team has taken a different approach and developed a "dry transfer" strategy based on oxides: first, a very thin layer of aluminum oxide is deposited by electron beam evaporation to enhance the interfacial bonding between oxides and molybdenum disulfide; Cover another layer of aluminum oxide with atomic layer deposition technology to form a high-quality and high dielectric constant gate dielectric layer. The transfer process avoids direct contact between the surface of molybdenum disulfide and polymers, water, or organic solvents throughout the entire process, effectively preserving the intrinsic properties of the material. Based on this process, our wafer level high-density flexible transistor array has achieved multiple performance breakthroughs. ”Kong Wei introduces. The research team used the transistor array for an active matrix tactile sensing system and attached it to the surface of a soft robotic gripper. The system can perceive and draw pressure distribution in real time, helping robots recognize the shape, position, and size of objects. (Looking into the New Era)