Recently, driven by the explosive demand for AI, the structural shortage of its upstream core material electronic glass fiber (electronic cloth) has become increasingly prominent, and product sales prices have risen. The reporter learned that during the 15th Five Year Plan period, China will accelerate the research and development of high-end electronic fabric equipment and domestic substitution. Relevant leading enterprises will also accelerate the layout of high-end electronic fabric products and concentrate on breaking through the core technology of the next generation of electronic fabric. Entering the Huai'an Zero Carbon Intelligent Manufacturing Base in China, I saw brand new kilns lined up in parallel in the workshop, waiting for a magnificent transformation. On March 18th, this production line with an annual output of 100000 tons of electronic glass fiber and 390 million meters of electronic cloth was successfully ignited. Its production capacity accounts for 9% of the global market and is the largest electronic grade glass fiber production line in the world. Among them, high-end electronic substrate varieties such as thin cloth and ultra-thin cloth account for 30%. Yang Guoming, General Manager of China Jushi, said that currently, China Jushi has a market share of 23% in the global electronic fiberglass market. In order to maintain stable supply and demand in the electronic fabric market, the 100000 ton production capacity that has been ignited this time will be released in batches. The copper-clad laminate formed by the combination of electronic fabric and resin is the substrate of printed circuit boards (PCBs), which are the physical carrier and electrical connector of all electronic components, from chips to sensors. The value of electronic fabric accounts for about 30% of the cost of copper-clad laminates and is a key variable in the PCB cost structure. Without high-end electronic fabric, there can be no high-performance PCB. ”Zhou Yuxian, Chairman of China National Building Materials Group, said that high-end electronic substrates are like the "highway subgrade" of the digital world - the subgrade is uneven, and even sports cars cannot run fast. Currently, AI、6G、 Intelligent connected vehicles have put forward unprecedented requirements for signal transmission speed, integrity, and low latency, driving the development of electronic substrates towards ultrafine, ultra-thin, and low dielectric directions, and placing higher demands on the performance of electronic fabrics. Starting from the second half of 2025, the iteration of AI chips is fundamentally changing the technical specifications and material usage of PCBs and packaging substrates. The demand for high-end electronic fabrics is growing rapidly, resulting in a continuous shortage of stock. The structural shortage of products has spread from high-end to ordinary products, driving up the prices of ordinary products. In response to this, Yang Guoming stated that excessively high prices or significant price fluctuations can pose challenges to the upstream and downstream of the industry. The company will listen to the voices of industry chain partners based on market demand and adjust product prices prudently. At present, the global electronic fabric industry presents a pattern of "China led production, high-end Japanese leading, and Asia Pacific demand driven". It is reported that about 75% of the global production capacity of CCL is concentrated in Chinese Mainland, which provides the widest application market and the fastest demand feedback channel for upstream electronic glass fiber. Meanwhile, after more than 30 years of continuous technological breakthroughs, leading enterprises have established a complete set of technology systems with completely independent intellectual property rights. They are at the forefront of the world in terms of large-scale and intelligent process equipment, cost control for large-scale production, and low-carbon manufacturing. It is worth noting that Nippon Paint controls about 90% of the global supply of high-end electronic fabrics. In the high-end electronic fabric field, such as extremely low dielectric and ultra-thin products used in ultra high speed data centers, millimeter wave radar, high-end AI chip test substrates, etc., we still have a certain gap with the international top level. ”Zhou Yuxian stated that high-end electronic substrates have long relied on imports, just like using someone else's foundation on a high-rise building, which always poses safety hazards. Facing the "15th Five Year Plan", China National Building Materials Group will rely on innovative platforms such as national enterprise technology centers, collaborate with downstream customers and research institutes, and concentrate efforts on breaking through the core technology of next-generation electronic fabrics; Strengthen collaborative innovation with copper-clad laminates, PCBs, terminal servers, and smart car manufacturers, with application as the driving force, to achieve upgrades from materials to solutions, ensuring the security and independent controllability of China's electronic information industry chain. The electronic fiberglass yarn industry in our country is not lagging behind Japan and the United States, but the problem lies in the supply of electronic fabrics. ”Liu Changlei, Secretary General of the China Glass Fiber Industry Association, stated that currently, key equipment for high-end fiberglass electronic fabric production, such as jet looms, tension controllers, and pulp and roll units, are overly dependent on imports, resulting in extended delivery cycles and constraining the development of fiberglass electronic fabric in China. He revealed that the association has recently conducted intensive visits to major domestic suppliers of air-jet loom equipment and established a consultation mechanism with the China Textile Machinery Association. It actively carries out precise docking between the capability list of textile equipment enterprises and the demand list of fiberglass products enterprises, and promotes collaborative innovation in the industrial chain. Through organizing scientific and technological breakthroughs, unveiling and leading the way, it accelerates the research and development of high-end electronic fabric equipment. (New Society)